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Sector 01

High-End Equipment

Ultrasonic machining equipment and core components, built on process know-how for hard-to-machine materials.

Illustrative image of an ultrasonic machining centre on a workshop floor

Flagship equipment

U20K-852H Ultrasonic Machining Centre

A three-axis vertical machining centre with a third-generation digital ultrasonic system. Shown at the 2026 Shanghai machine tool exhibition with Baoji Machine Tool Group under the Baoji Leidao co-brand.

Configuration
3-axis vertical
Ultrasonic frequency
20–40 kHz
Amplitude
0.5–5 µm
Technology readiness
TRL 7–8

Application cases

  • 0.3 mm slot

    Tungsten-nickel-iron alloy

    Conventional tools break on contact. Stable machining was achieved, with tool life of one workpiece or more.

  • 62 : 1

    Copper deep hole

    Ø1.8 mm, 112 mm deep. About 15 minutes per hole, tool life of 50+ pieces, smooth wall and burr-free exit.

  • −80%

    Titanium shackle drilling

    Cycle time cut from 60 to 12 minutes per piece (80% shorter), with no tool wear after 12 pieces.

  • Ra < 0.1 µm

    Carbide mould

    Mirror-level finish on a phone-case mould, without further polishing.

  • 87 s

    316 stainless steel drilling

    Per piece at Ra 0.125 µm, with very slight tool wear.

Results from owner-provided Leidao technical materials.

Manufacturing capability

From Single Machines to Production Lines

Equipment, workshop and line, shown as concept visuals. The diagram below explains the model.

Illustrative image of a production line of machine tools
Illustrative image of a production workshop with machine tools

Concept visuals. Not photographs of actual SPETEC or Leidao equipment, facilities, staff or exhibitions.

20,000+

micro-motions per second

Ultrasonic technology

Leidao ultrasonic systems apply more than 20,000 high-frequency micro-motions per second to the machining process.

How ultrasonic machining works

Measured performance

Measured Performance

Results from Leidao ultrasonic machining compared with conventional tools, across difficult-to-machine materials.

Highlight · Aluminium alloy 7050

~60×

Tool life

A conventional tool failed after 6 holes. Leidao ultrasonic drilled 362 holes.

  • SiC plate

    800%

    Efficiency improvement

    Tool-wear comparison 1:7

  • Alumina ceramic

    750%

    Efficiency improvement

    Tool-wear comparison 1:6

  • High-temperature alloy

    ~7×

    Efficiency

    48 holes: 432 s → 58 s per hole

  • Titanium alloy TC18

    ~4×

    Efficiency improvement

    Compared with conventional machining

  • High-temperature alloy

    0.02 mm

    Leidao tool wear

    Measured after machining. The conventional tool was scrapped.

Engineering comparison

Time per hole, high-temperature alloy

Conventional432 s
Leidao58 s

Holes before tool failure, aluminium 7050

Conventional6 holes
Leidao362 holes

Surface texture at 130× magnification

Leidao machining leaves a regular, ordered texture. Conventional machining leaves a disordered one. A regular texture means precision, consistency and a controllable surface function.

Results from owner-provided Leidao technical test materials.

Group-reported performance

Comparative Machining Performance

>300%
Machining efficiency improvement
50%
Tool wear reduction

Figures reported by the group, compared with conventional machine tools, for ultrasonic machining of materials such as silicon carbide, zirconia, titanium and high-temperature alloys. They do not apply to every machine, material or operating condition.

Materials and applications

Leidao ultrasonic machining is applied across hard, brittle and heat-resistant materials.

  • 01

    SiC

    Silicon carbide, an extremely hard ceramic for demanding environments.

    Tool-wear 1:7 · efficiency +800%

  • 02

    Alumina Ceramics

    Dense, hard and brittle ceramic used in electronic and wear components.

    Tool-wear 1:6 · efficiency +750%

  • 03

    Advanced Ceramics

    Hard, brittle and heat-resistant engineering ceramics.

  • 04

    Titanium Alloys

    High strength for their weight, but difficult to machine.

    Efficiency ~4× (TC18)

  • 05

    High-temperature Alloys

    Alloys designed to keep their strength at high temperature.

    48 holes: 432 s → 58 s per hole

  • 06

    Aluminium Alloys

    Light structural alloys used in aerospace and equipment.

    Tool life ~60× (7050)

  • 07

    Diamond-related Materials

    Diamond and diamond-based materials for thermal and semiconductor uses.

Broader application areas

Aluminium nitride and ceramic matrix composites are further areas for the same approach.

  • 08

    Aluminium Nitride

    A ceramic valued for high thermal conductivity.

  • 09

    CMC

    Ceramic matrix composites: ceramic fibres in a ceramic matrix.

Materials and applications

Machined Components and Materials

Representative components in difficult-to-machine materials.

  • Illustrative image of precision machined components

    Precision components

  • Illustrative close-up of a machined titanium alloy part

    Titanium alloy part

  • Illustrative close-up of a machined ceramic block

    Ceramic block

  • Illustrative close-up of a semiconductor wafer on a holder

    Semiconductor wafer

Concept visuals. Not photographs of actual SPETEC or Leidao equipment, facilities, staff or exhibitions.

AI infrastructure

Manufacturing for the AI Infrastructure Era

As compute grows, two physical limits appear: how AI hardware is made, and how its heat is removed. Both come down to machining the hardest materials precisely.

  • 01

    AI Hardware Manufacturing

    Precision machining for:

    • Advanced ceramics
    • SiC
    • Diamond-related materials
    • Precision thermal components
  • 02

    Thermal Management Manufacturing

    Precision shaping of:

    • Hard and brittle thermal substrates
    • Micro-channel structures
    • Diamond-related thermal materials

As AI pushes compute higher, Leidao drives manufacturing cost lower.

Diamond

Diamond Precision Processing

Leidao combines its own ultrasonic grinding equipment with diamond-wafer process engineering.

  1. 01

    MPCVD diamond blank

  2. 02

    Ultrasonic rough grinding

  3. 03

    Precision grinding and flatness control

  4. 04

    Ultrasonic polishing

  5. 05

    CMP

  6. 06

    Cleaning, inspection and packaging

  7. 07

    Semiconductor and AI thermal applications

Key idea

Equipment + Process

In-house ultrasonic grinding equipment and diamond-wafer precision processing work together, so equipment and process engineering drive each other.

Case study

Cost Case

Ultrasonic machining makes hard, brittle thermal substrates economical to produce.

F-type ceramic chuck processing

Leidao processing cost6,500 RMB / set
Market processing cost11,000 RMB / set
Market supply price13,000 RMB / set

~41%

lower processing cost than market processing

Owner-provided example case.

Engineering and R&D

Engineers Working With the Process

Process engineering, control software and research come together around each machine.

Illustrative image of engineers discussing a part design at a workstation
Illustrative image of engineers reviewing a machining model on screens
Illustrative image of a machine control screen with process data

Concept visuals. Not photographs of actual SPETEC or Leidao equipment, facilities, staff or exhibitions.

Credibility

Exhibitions and Partners

The group presents its equipment at machine tool exhibitions and works with research and industry partners.

Illustrative image of a machine tool exhibition stand
Illustrative image of an exhibition stand with visitors

Concept visuals. Not photographs of actual SPETEC or Leidao equipment, facilities, staff or exhibitions.

Precision Engineering

Ultrasonic precision engineering is combined with machine-tool know-how for hard-to-machine materials.

  1. 01

    Material

    Each material class brings its own machining challenges.

  2. 02

    Tool and process

    Tooling, machine and ultrasonic parameters are matched to the material.

  3. 03

    Process data

    Signals and outcomes are recorded during production.

  4. 04

    Process model

    Recorded knowledge becomes a repeatable process model.

Group-reported: 145,000 m² ultrasonic equipment manufacturing and assembly base, completed in 2025.

Read the group profile

Equipment roadmap

Next: Fractional-order Machining and Tool Production

Two programmes that extend the platform. Both are planned or in development. Neither is an available product.

  • Planned · prototype 2027

    Seven-axis, five-linkage mill-turn-grind centre

    Integrates third-generation intelligent ultrasonic with fractional-order control, for high-performance ceramics and ceramic matrix composites.

  • In development

    Fractional-order ultrasonic tool grinding line

    A five-axis ultrasonic tool grinder with coating integration, towards a flexible line for high-performance cutting tools.

Engineering targets for the 2027 prototype

  • Linear axis positioning ≤ 0.004 mm
  • Repeat positioning ≤ 0.002 mm
  • Rotary axis positioning ≤ 5 arc-seconds

Targets, not measured results.

Let's Engineer What's Next.

Tell us about your manufacturing process, equipment or project, or explore a partnership with the group.